Olympus BX51M Metallurgical Microscope with DIC

Olympus BX51M Metallurgical Microscope with DIC

The Olympus BX51M is a high-quality upright metallurgical microscope specifically developed for advanced material analysis, quality control, and research applications. Thanks to the UIS2 Infinity Optical System, the microscope delivers exceptionally high resolution, true-to-life color reproduction, and a flat image across the entire field of view.

This configuration features a DIC (Differential Interference Contrast) set, allowing even extremely small height differences and surface details to be visible with high contrast. This makes the BX51M particularly suitable for inspecting metals, semiconductors, coatings, electronic components, and other industrial materials where conventional bright-field microscopy falls short. The microscope is equipped with a trinocular tube for connecting a digital camera, a mechanical stage, a multi-objective turret, and high-quality Olympus objectives:

Olympus MPLNFL N 4x

Olympus MPLANFL N 10x

Additional objectives are available at an extra cost for higher magnification applications. Key Features

Olympus BX51M Metallurgical Microscope

Equipped with Differential Interference Contrast (DIC)

Olympus UIS2 Infinity Corrected Optical System

Trinocular tube for camera connection

Mechanical XY stage

Multi-objective turret

High-quality plan objectives

Modularly expandable

Suitable for image acquisition and analysis

Technical Specifications

Specification Value

Model Olympus BX51M

Type Upright metallurgical microscope

Optical System Olympus UIS2 Infinity Optical System

Contrast Method Brightfield + DIC (Differential Interference Contrast)

Tube Trinocular

Camera Connection Yes

Turret Multiple objective turret

Terminal stage Mechanical XY stage

Focus Coaxial coarse and fine focusing

Fine adjustment 1 µm per Scale

Focus range 25 mm

Illumination Halogen lighting with adjustable light intensity

Power supply 100–240 V, 50/60 Hz

Included lenses

Lens Magnification Numerical aperture Working distance

Olympus MPLNFL N 4× NA 0.10 approx. 18 mm

Olympus MPLANFL N 10× NA 0.25 approx. 10.6 mm

Optionally available:

20× lens

50× lens

100× lens

Other Olympus UIS2 lenses on request

Dimensions

Width: approx. 283 mm

Depth: approx. 464 mm

Height: approx. 465 mm

Weight: approx. 10 kg (depending on configuration)

Applications

The The Olympus BX51M with DIC is ideal for:

Metallography

Materials testing

Semiconductor inspection

Electronics and PCB inspection

Analysis of coatings and thin layers

Quality control

Industrial laboratories

Universities and research institutes

Thanks to the combination of Differential Interference Contrast (DIC), high-quality Olympus plan lenses, and the ability to connect a camera, the Olympus BX51M delivers exceptional image quality for both visual inspection and digital documentation. Furthermore, the modular design makes it easy to expand the system with additional lenses and accessories, allowing it to be fully tailored to your specific research or inspection applications.